Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2017-03-28 |
| 9607947 | Reliable microstrip routing for electronics components | Nevin Altunyurt, Kyu Oh Lee, Krishna Bharath | 2017-03-28 |
| 9583470 | Electronic device with solder pads including projections | Nitin A. Deshpande | 2017-02-28 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2017-02-21 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 9397071 | High density interconnection of microelectronic devices | John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2016-07-19 |
| 9391025 | Reliable microstrip routing for electronics components | Nevin Altunyurt, Kyu Oh Lee, Krishna Bharath | 2016-07-12 |
| 9275955 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2016-03-01 |
| 9076882 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Nitin A. Deshpande | 2015-07-07 |
| 9041205 | Reliable microstrip routing for electronics components | Nevin Altunyurt, Kyu Oh Lee, Krishna Bharath | 2015-05-26 |