Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Nitin A. Deshpande | 2021-09-07 |
| 11056466 | Package on package thermal transfer systems and methods | Christopher L. Rumer, Nitin A. Deshpande, Robert M. Nickerson | 2021-07-06 |
| 10797000 | Embedded multi-device bridge with through-bridge conductive via signal connection | Nitin A. Deshpande | 2020-10-06 |
| 10741419 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2020-08-11 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2020-06-02 |
| 10461003 | Electronic package that includes multiple supports | Kedar Dhane | 2019-10-29 |
| 10438930 | Package on package thermal transfer systems and methods | Christopher L. Rumer, Nitin A. Deshpande, Robert M. Nickerson | 2019-10-08 |
| 10403512 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 |
| 10290561 | Thermal interfaces for integrated circuit packages | Edvin Cetegen, Kedar Dhane, Chandra Mohan Jha | 2019-05-14 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Nitin A. Deshpande | 2019-04-09 |
| 10229882 | Embedded multi-device bridge with through-bridge conductive via signal connection | Nitin A. Deshpande | 2019-03-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Nitin A. Deshpande, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |
| 10157860 | Component stiffener architectures for microelectronic package structures | Kedar Dhane, Yongki Min, William J. Lambert | 2018-12-18 |
| 10109616 | High bandwidth, low profile multi-die package | — | 2018-10-23 |
| 10068852 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2018-09-04 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-06-05 |
| 9899238 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-02-20 |
| 9842832 | High density interconnection of microelectronic devices | John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9795038 | Electronic package design that facilitates shipping the electronic package | Nitin A. Deshpande, Nachiket R. Raravikar | 2017-10-17 |
| 9754890 | Embedded multi-device bridge with through-bridge conductive via signal connection | Nitin A. Deshpande | 2017-09-05 |
| 9741692 | Methods to form high density through-mold interconnections | Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2017-07-25 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9685421 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Nitin A. Deshpande | 2017-06-20 |