Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Aleksandar Aleksov, Charavana K. Gurumurthy, Ching-Ping Janet Shen, Daniel N. Sobieski | 2018-10-16 |
| 10068776 | Raster-planarized substrate interlayers and methods of planarizing same | Frank Truong, Praneeth Akkinepally, Shruti R. Jaywant | 2018-09-04 |
| 10070537 | Formation of dielectric with smooth surface | Deepak Arora, Daniel N. Sobieski, Ebrahim Andideh, James C. Meyer | 2018-09-04 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |
| 9799593 | Semiconductor package substrate having an interfacial layer | Whitney Bryks, Bainye Francoise ANGOUA | 2017-10-24 |
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Padam Jain, Chi-Mon Chen | 2017-10-10 |
| 9646854 | Embedded circuit patterning feature selective electroless copper plating | Yonggang Li, Aritra Dhar, Jon M. Williams | 2017-05-09 |
| 9554472 | Panel with releasable core | Ching-Ping Janet Shen, Ravi Shankar, Yonggang Li, Charan Gurumurthy | 2017-01-24 |
| 9554468 | Panel with releasable core | Ching-Ping Janet Shen, Charan Gurumurthy, Ravi Shankar, Liwen Jin, Deepak Arora | 2017-01-24 |
| 9451696 | Embedded architecture using resin coated copper | Ching-Ping Janet Shen, Liwen Jin, Deepak Arora, Vinodhkumar Raghunathan | 2016-09-20 |
| 9320149 | Bumpless build-up layer package including a release layer | Liwen Jin | 2016-04-19 |
| 9159649 | Microelectronic package and stacked microelectronic assembly and computing system containing same | Pramod Malatkar, Drew W. Delaney, Rahul N. Manepalli | 2015-10-13 |
| 7909977 | Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby | Houssam Jomaa, Amruthavalli Pallavi Alur | 2011-03-22 |