Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Via structures having tapered profiles for embedded interconnect bridge substrates

Via structures having tapered profiles for embedded interconnect bridge substrates

US Patent 11721631 · Granted Aug 8, 2023

Estimated economic value: $22,376,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Faraday rotator interconnect as a through-via configuration in a patch architect2025
Systems and methods for cloud based root service application across multiple coo2025
First layer interconnect first on carrier approach for EMIB patch2025
Position controlled waveguides and methods of manufacturing the same2025
Position controlled waveguides and methods of manufacturing the same2025
Hybrid bonding technologies with thermal expansion compensation structures2025
Method and device of accessing memory with near memory accelerator2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025
Microelectronic assemblies including interconnects with different solder materia2025
Closure device and soft packaging container2025
Device and method for improved fiducial marker detection2025
Methods and apparatus to increase glass core thickness2025