Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11569160 | Patterning of dual metallization layers | — | 2023-01-31 |
| 11528811 | Method, device and system for providing etched metallization structures | Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2022-12-13 |
| 11404389 | In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages | Suddhasattwa Nad, Kristof Darmawikarta, Yonggang Li, Xiaoying Guo | 2022-08-02 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2022-06-28 |
| 11116084 | Method, device and system for providing etched metallization structures | Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2021-09-07 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2021-08-03 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally | 2021-02-16 |
| 10910327 | Electronic device package with reduced thickness variation | Yonggang Li, Brandon C. Marin, Vahidreza Parichehreh | 2021-02-02 |
| 10515824 | Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field | Leonel Arana, Nicholas S. Haehn, Hsin-Wei Wang, Oscar Ojeda, Arnab Roy | 2019-12-24 |
| 10438812 | Anisotropic etching systems and methods using a photochemically enhanced etchant | Changhua Liu, Arnab Roy, Oscar Ojeda, Timothy A. White, Nicholas S. Haehn | 2019-10-08 |