Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Ram Viswanath, Rajasekaran Swaminathan, Robert M. Nickerson +2 more | 2013-08-20 |
| 8383459 | Methods of processing a thermal interface material | Lakshmi Supriya, Jessica Weninger, Lateef Mustapha | 2013-02-26 |
| 8304065 | Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same | Dingying Xu, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani, Shankar Ganapathysubramanian +2 more | 2012-11-06 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2012-10-16 |
| 8163598 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, James Mellody, George Vakanas | 2012-04-24 |
| 8009442 | Directing the flow of underfill materials using magnetic particles | Stephen Lehman, Rahul N. Manepalli, Wendy Chan | 2011-08-30 |
| 7971347 | Method of interconnecting workpieces | Rob Nickerson, Lim Chong Sim, Edward R. Prack, Yoshihiro Tomita | 2011-07-05 |
| 7892883 | Clipless integrated heat spreader process and materials | George Kostiew, Raj Bahadur, James Mellody, George Vakanas | 2011-02-22 |
| 7666768 | Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance | Nachiket R. Raravikar, Daewoong Suh, James C. Matayabas, Jr. | 2010-02-23 |
| 7592697 | Microelectronic package and method of cooling same | Michael Newman, Je-Young Chang | 2009-09-22 |
| 7528006 | Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion | Michael Newman, Devendra Natekar | 2009-05-05 |
| 7462551 | Adhesive system for supporting thin silicon wafer | Sudhakar N. Kulkarni, Edward R. Prack | 2008-12-09 |
| 7402515 | Method of forming through-silicon vias with stress buffer collars and resulting devices | Devendra Natekar, Michael Newman, Charan Gurumurthy | 2008-07-22 |
| 7267779 | Thermally efficient micromachined device | Aleksander Franz, Klavs F. Jensen, Samuel B. Schaevitz, Martin Schmidt | 2007-09-11 |
| 7243833 | Electrically-isolated interconnects and seal rings in packages using a solder preform | John Heck | 2007-07-17 |
| 7224050 | Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging | James C. Matayabas, Jr., Stephen Lehman | 2007-05-29 |
| 7144299 | Methods and devices for supporting substrates using fluids | Terry Sterrett, Devendra Natekar | 2006-12-05 |
| 7087451 | Microfabricated hot wire vacuum sensor | Yuelin Lee Zou, John Heck | 2006-08-08 |
| 6939632 | Thermally efficient micromachined device | Aleksander Franz, Klavs F. Jensen, Samuel B. Schaevitz, Martin Schmidt | 2005-09-06 |