Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764150 | Inductors for package substrates | Sri Chaitra Jyotsna Chavali, Wei-Lun Kane Jen | 2023-09-19 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2021-11-02 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Sarah Haney, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 |