Issued Patents All Time
Showing 26–50 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |
| 11817444 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik | 2023-10-24 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2023-09-19 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan | 2023-09-12 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11705377 | Stacked die cavity package | Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan | 2023-07-04 |
| 11658122 | EMIB patch on glass laminate substrate | Robert Alan May | 2023-05-23 |
| 11652020 | Thermal solutions for multi-package assemblies and methods for fabricating the same | Chia-Pin Chiu | 2023-05-16 |
| 11652057 | Disaggregated die interconnection with on-silicon cavity bridge | Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Telesphor Kamgaing, Wil Choon Song +1 more | 2023-05-16 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Pooya Tadayon, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2023-04-11 |
| 11581287 | Chip scale thin 3D die stacked package | Sanka Ganesan, Bernd Waidhas, Thomas Wagner, Lizabeth Keser | 2023-02-14 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Debendra Mallik | 2023-01-03 |
| 11521923 | Integrated circuit package supports | Kevin Thomas McCarthy | 2022-12-06 |
| 11515232 | Liquid cooling through conductive interconnect | Chia-Pin Chiu, Pooya Tadayon | 2022-11-29 |
| 11444033 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Scott M. Mokler, Richard C. Stamey | 2022-09-13 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2022-08-30 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11410919 | Stacked silicon die architecture with mixed flipcip and wirebond interconnect | Sanka Ganesan | 2022-08-09 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11348911 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2022-05-31 |
| 11328968 | Stacked die cavity package | Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |