Issued Patents All Time
Showing 76–100 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10576590 | Torque controlled driver apparatus and method | Batsegaw K. Gebrehiwot, Joseph B. Petrini, Nicholas S. Haehn, Shankar Devasenathipathy, Alfredo Cardona | 2020-03-03 |
| 10535595 | Conductive base embedded interconnect | Adel A. Elsherbini | 2020-01-14 |
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Kemal Aygun | 2019-09-17 |
| 10396046 | Substrate assembly with magnetic feature | Yikang Deng | 2019-08-27 |
| 10325860 | Microelectronic bond pads having integrated spring structures | Feras Eid, Sandeep B. Sane | 2019-06-18 |
| 10304769 | Multi-die package | Allan A. Ovrom, III, Robert Starkston, Oren Arad | 2019-05-28 |
| 10264717 | Electromagnetic interference shields for electronic packages and related methods | — | 2019-04-16 |
| 10204851 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2019-02-12 |
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2018-12-25 |
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Eric J. Li, Yoshihiro Tomita, Nachiket R. Raravikar | 2018-12-25 |
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2018-12-18 |
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson | 2018-11-13 |
| 10090277 | 3D integrated circuit package with through-mold first level interconnects | Debendra Mallik | 2018-10-02 |
| 10070524 | Method of making glass core substrate for integrated circuit devices | Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao | 2018-09-04 |
| 10056182 | Surface-mount inductor structures for forming one or more inductors with substrate traces | Gregorio R. Murtagian, Brent Stone, Kaladhar Radhakrishnan, Joshua D. Heppner | 2018-08-21 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov | 2018-06-26 |
| 10002814 | Apparatuses and methods to enhance passivation and ILD reliability | Richard J. Harries, Sudarashan V. Rangaraj | 2018-06-19 |
| 9971089 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Kemal Aygun | 2018-05-15 |
| 9941054 | Integration of embedded thin film capacitors in package substrates | Daniel N. Sobieski, Sri Ranga Sai Boyapati | 2018-04-10 |
| 9927211 | Cloaking system with waveguides | Ian A. Young, Johanna M. Swan, Marko Radosavljevic | 2018-03-27 |
| 9922916 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2018-03-20 |
| 9918414 | Electromagnetic interference shields for electronic packages and related methods | — | 2018-03-13 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |
| 9847234 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2017-12-19 |