Issued Patents All Time
Showing 101–125 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Charles A. Gealer, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9807866 | Shielding mold for electric and magnetic EMI mitigation | Zhichao Zhang, Adel A. Elsherbini, Kemal Aygun | 2017-10-31 |
| 9741664 | High density substrate interconnect formed through inkjet printing | Chia-Pin Chiu, Kinya Ichikawa | 2017-08-22 |
| 9708178 | Integration of laminate MEMS in BBUL coreless package | Weng Hong Teh | 2017-07-18 |
| 9686861 | Glass core substrate for integrated circuit devices and methods of making the same | Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao | 2017-06-20 |
| 9646851 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2017-05-09 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov | 2017-05-02 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | Weng Hong Teh, John S. Guzek | 2017-02-21 |
| 9543224 | Hybrid exposure for semiconductor devices | Thorsten Meyer, Gerald Ofner | 2017-01-10 |
| 9530758 | 3D integrated circuit package with through-mold first level interconnects | Debendra Mallik | 2016-12-27 |
| 9420693 | Integration of embedded thin film capacitors in package substrates | Daniel N. Sobieski, Sri Ranga Sai Boyapati | 2016-08-16 |
| 9374162 | Semiconductor package with optical port | Johanna M. Swan, Dmitri E. Nikonov, Raseong Kim | 2016-06-21 |
| 9368437 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Chia-Pin Chiu, Kinya Ichikawa | 2016-05-24 |
| 9310565 | Cloaking system with waveguides | Ian A. Young, Johanna M. Swan, Marko Radosavljevic | 2016-04-12 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2016-03-29 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Eric J. Li | 2016-02-16 |
| 9224674 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, Weng Hong Teh, John S. Guzek | 2015-12-29 |
| 9190388 | Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate | Edward A. Zarbock | 2015-11-17 |
| 9177831 | Die assembly on thin dielectric sheet | Chia-Pin Chiu, Qing Ma, Paul B. Fischer, Patrick Morrow, William J. Lambert +2 more | 2015-11-03 |
| 9099444 | 3D integrated circuit package with through-mold first level interconnects | Debendra Mallik | 2015-08-04 |
| 9001520 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov | 2015-04-07 |
| 8987918 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson | 2015-03-24 |
| 8969140 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2015-03-03 |