Issued Patents All Time
Showing 126–150 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8963135 | Integrated circuits and systems and methods for producing the same | Dmitri E. Nikonov, Raseong Kim, Jin Pan | 2015-02-24 |
| 8535989 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2013-09-17 |
| 8465297 | Self referencing pin | Bin Zou, Yan Guo, Jiangqi He | 2013-06-18 |
| 8450857 | Through mold via polymer block package | Mihir K. Roy, Islam A. Salama, Charavana K. Gurumurthy | 2013-05-28 |
| 8354748 | In-package microelectronic apparatus, and methods of using same | Sriram Dattaguru, Lesley A. Polka Wood, Yoshihiro Tomita, Kiniya Ichikawa | 2013-01-15 |
| 8278214 | Through mold via polymer block package | Mihir K. Roy, Islam A. Salama, Charavana K. Gurumurthy | 2012-10-02 |
| 8207453 | Glass core substrate for integrated circuit devices and methods of making the same | Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao | 2012-06-26 |
| 8110920 | In-package microelectronic apparatus, and methods of using same | Sriram Dattaguru, Lesley A. Polka Wood, Yoshihiro Tomita, Kinya Ichikawa | 2012-02-07 |
| 7932596 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Debendra Mallik | 2011-04-26 |
| 7852189 | Packaged spiral inductor structures, processes of making same, and systems containing same | Jiangqi He, BaoShu Xu, Xiang Yin Zeng | 2010-12-14 |
| 7637008 | Methods for manufacturing imprinted substrates | Thomas Dory, Michael Walk, Boyd Coomer | 2009-12-29 |
| 7456047 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Debendra Mallik | 2008-11-25 |
| 7268425 | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method | Debendra Mallik | 2007-09-11 |
| 7239524 | Resistive element apparatus and method | Chee-Yee Chung, Alex Waizman | 2007-07-03 |
| 7212405 | Method and apparatus for providing distributed fluid flows in a thermal management arrangement | Ravi Prasher | 2007-05-01 |
| 7133294 | Integrated circuit packages with sandwiched capacitors | Priyavadan R. Patel, Chee-Yee Chung, David G. Figueroa, Yuan-Liang Li, Hong Xie +1 more | 2006-11-07 |
| 7046528 | Load-dependent variable frequency voltage regulator | Shamala Chickamenahalli | 2006-05-16 |
| 6900991 | Electronic assembly with sandwiched capacitors and methods of manufacture | Priyavadan R. Patel, Chee-Yee Chung, David G. Figueroa, Yuan-Liang Li, Hong Xie +1 more | 2005-05-31 |
| 6717277 | Electrical assembly with vertical multiple layer structure | Chee-Yee Chung, David G. Figueroa | 2004-04-06 |
| 6680218 | Fabrication method for vertical electronic circuit package and system | Chee-Yee Chung, David G. Figueroa | 2004-01-20 |
| 6664483 | Electronic package with high density interconnect and associated methods | Tee Onn Chong, Seng Hooi Ong | 2003-12-16 |
| 6632734 | Parallel plane substrate | — | 2003-10-14 |
| 6563210 | Parallel plane substrate | — | 2003-05-13 |
| 6555920 | Vertical electronic circuit package | Chee-Yee Chung, David G. Figueroa | 2003-04-29 |
| 6493223 | Computer utilizing refrigeration for cooling | Ram Viswanath, Hong Xie | 2002-12-10 |