Issued Patents All Time
Showing 51–75 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276630 | Planar integrated circuit package interconnects | Sanka Ganesan | 2022-03-15 |
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2022-02-22 |
| 11257688 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2022-02-22 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |
| 11201128 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, Weng Hong Teh, John S. Guzek | 2021-12-14 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik | 2021-11-02 |
| 11127727 | Thermal spreading management of 3D stacked integrated circuits | Pooya Tadayon, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2021-09-21 |
| 11112841 | 5G mmWave cooling through PCB | Divya Mani, William J. Lambert, Shawna M. Liff, Sergio Antonio Chan Arguedas | 2021-09-07 |
| 11114394 | Signal routing carrier | Lijiang Wang, Jianyong Xie, Sujit Sharan | 2021-09-07 |
| 11114353 | Hybrid microelectronic substrates | Robert Starkston, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur | 2021-09-07 |
| 11107780 | Pseudo-stripline using double solder-resist structure | Lilia May, Robert Alan May, Amruthavalli Pallavi Alur | 2021-08-31 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2021-06-22 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more | 2021-04-20 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Debendra Mallik | 2021-02-02 |
| 10811366 | Microelectronic bond pads having integrated spring structures | Feras Eid, Sandeep B. Sane | 2020-10-20 |
| 10763215 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Scott M. Mokler, Richard C. Stamey | 2020-09-01 |
| 10716214 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Richard C. Stamey, Scott M. Mokler | 2020-07-14 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2020-07-07 |
| 10700051 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2020-06-30 |
| 10685947 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2020-06-16 |
| 10658279 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2020-05-19 |
| 10651051 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2020-05-12 |
| 10651116 | Planar integrated circuit package interconnects | Sanka Ganesan | 2020-05-12 |
| 10634594 | Membrane test for mechanical testing of stretchable electronics | Ravindranth V. Mahajan, Rajendra C. Dias, Pramod Malatkar, Steven A. Klein, Vijay Subramania +1 more | 2020-04-28 |