Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322710 | Three-dimensional memory device with finned support pillar structures and method of forming the same | Johann Alsmeier, Koichi Matsuno | 2025-06-03 |
| 11380707 | Three-dimensional memory device including backside trench support structures and methods of forming the same | Koichi Matsuno, Johann Alsmeier | 2022-07-05 |
| 11043455 | Three-dimensional memory device including self-aligned dielectric isolation regions for connection via structures and method of making the same | James Kai, Johann Alsmeier | 2021-06-22 |
| 10854629 | Three-dimensional memory device containing asymmetric, different size support pillars and method for making the same | Chun Ge, Fabo Yu, Xin Li, Yanli Zhang | 2020-12-01 |
| 10825826 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Tae Kyung Kim, Johann Alsmeier, Yan Li, Jian Chen | 2020-11-03 |
| 10804197 | Memory die containing stress reducing backside contact via structures and method of making the same | Motoki KAWASAKI, Arata Okuyama, Xun Gu, Kengo Kajiwara | 2020-10-13 |
| 10707228 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Tae Kyung Kim, Johann Alsmeier, Yan Li, Jian Chen | 2020-07-07 |
| 10672657 | Semiconductor device structures including stair step structures, and related semiconductor devices | Matthew Park, Adam L. Olson | 2020-06-02 |
| 10658381 | Memory die having wafer warpage reduction through stress balancing employing rotated three-dimensional memory arrays and method of making the same | Fumiaki Toyama, Masaaki Higashitani, Tong Zhang, Chun Ge, Xin Li +1 more | 2020-05-19 |
| 10453748 | Methods of forming semiconductor device structures including stair step structures | Matthew Park, Adam L. Olson | 2019-10-22 |
| 10381443 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kazuyo Matsumoto, Yasuo Kasagi, Satoshi Shimizu, Hiroyuki Ogawa, Yohei Masamori +2 more | 2019-08-13 |
| 10354956 | Three-dimensional memory device containing hydrogen diffusion barrier structures for CMOS under array architecture and method of making the same | Daxin Mao, Hiroyuki Ogawa, Johann Alsmeier | 2019-07-16 |
| 10269620 | Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof | Zhenyu Lu, Hiroyuki Ogawa, Daxin Mao, Kensuke Yamaguchi, Sung-Tae Lee +2 more | 2019-04-23 |
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Johann Alsmeier, Fumiaki Toyama, Yuki Mizutani, Hiroyuki Ogawa +5 more | 2019-04-09 |
| 10249640 | Within-array through-memory-level via structures and method of making thereof | Zhenyu Lu, Alexander Chu, Kensuke Yamaguchi, Hiroyuki Ogawa, Daxin Mao +2 more | 2019-04-02 |
| 10217746 | Three-dimensional memory device having L-shaped word lines and a support structure and methods of making the same | Tae Kyung Kim, Raghuveer S. Makala, Yanli Zhang, Hiroyuki Kinoshita, Daxin Mao +5 more | 2019-02-26 |
| 10115732 | Three dimensional memory device containing discrete silicon nitride charge storage regions | Zhenyu Lu, Daxin Mao, Yanli Zhang, Andrey Serov, Chun Ge +1 more | 2018-10-30 |
| 10115440 | Word line contact regions for three-dimensional non-volatile memory | Qui Vi Nguyen, Alexander Chu, Kenneth Louie, Anirudh Amarnath, Yen-Lung Li +2 more | 2018-10-30 |
| 10074666 | Three-dimensional memory device with enhanced mechanical stability semiconductor pedestal and method of making thereof | Chun Ge, Yanli Zhang, Johann Alsmeier, Fabo Yu | 2018-09-11 |
| 10038006 | Through-memory-level via structures for a three-dimensional memory device | Yoko Furihata, Hiroyuki Ogawa, James Kai, Jin Liu, Johann Alsmeier | 2018-07-31 |
| 10020363 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Hiroyuki Ogawa, Yasuo Kasagi, Satoshi Shimizu, Kazuyo Matsumoto, Yohei Masamori +2 more | 2018-07-10 |
| 10008570 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kento KITAMURA, Tong Zhang, Chun Ge, Yanli Zhang, Satoshi Shimizu +6 more | 2018-06-26 |
| 9985098 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kazuyo Matsumoto, Yasuo Kasagi, Satoshi Shimizu, Hiroyuki Ogawa, Yohei Masamori +2 more | 2018-05-29 |
| 9985046 | Method of forming a staircase in a semiconductor device using a linear alignment control feature | Zhenyu Lu, Koji Miyata, Makoto Yoshida, Johann Alsmeier, Hiro Kinoshita +1 more | 2018-05-29 |
| 9859363 | Self-aligned isolation dielectric structures for a three-dimensional memory device | Zhenyu Lu, Kota Funayama, Chun-Ming Wang, Chenche Huang, Tong Zhang +4 more | 2018-01-02 |