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James Kai, Murshed Chowdhury, Johann Alsmeier |
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Three-dimensional memory device with thickened word lines in terrace region |
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2019-03-05 |
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Chun Ge, Johann Alsmeier |
2018-10-30 |
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2018-07-31 |
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Multi-tier three-dimensional memory devices containing annular dielectric spacers within memory openings and methods of making the same |
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2018-06-05 |
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2018-05-15 |
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James Kai, Murshed Chowdhury, Johann Alsmeier |
2018-05-15 |
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Tong Zhang, Johann Alsmeier, James Kai, Yanli Zhang |
2018-03-13 |
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James Kai, Johann Alsmeier, Yanli Zhang |
2017-11-28 |
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Through-memory-level via structures for a three-dimensional memory device |
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2017-11-14 |
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Chun Ge, Johann Alsmeier |
2017-10-03 |
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Yanli Zhang, Murshed Chowdhury, Raghuveer S. Makala, Johann Alsmeier |
2017-07-04 |
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Multilevel memory stack structure employing support pillar structures |
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2017-04-18 |
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2017-02-14 |
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