Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11675654 | Systems and methods for error recovery | Bharadwaj Pudipeddi, Maral Mesmakhosroshahi, Jinwen Xi, Saurabh M. Kulkarni, Marc Tremblay +1 more | 2023-06-13 |
| 11226859 | Systems and methods for error recovery | Bharadwaj Pudipeddi, Maral Mesmakhosroshahi, Jinwen Xi, Saurabh M. Kulkarni, Marc Tremblay +1 more | 2022-01-18 |
| 10777570 | Multi-tier three-dimensional memory devices containing annular dielectric spacers within memory openings and methods of making the same | Tadashi Nakamura, Jin Liu, Kazuya Tokunaga, Marika Gunji-Yoneoka, Hiroyuki Kinoshita +2 more | 2020-09-15 |
| 10381083 | Bit line control that reduces select gate transistor disturb in erase operations | Xiang Yang, Kun-Huan Shih, Huai-Yuan Tseng, Dengtao Zhao, Deepanshu Dutta | 2019-08-13 |
| 9991280 | Multi-tier three-dimensional memory devices containing annular dielectric spacers within memory openings and methods of making the same | Tadashi Nakamura, Jin Liu, Kazuya Tokunaga, Marika Gunji-Yoneoka, Hiroyuki Kinoshita +6 more | 2018-06-05 |
| 9870945 | Crystalline layer stack for forming conductive layers in a three-dimensional memory structure | Jayavel Pachamuthu, Stephen Shi, Johann Alsmeier, Henry Chien | 2018-01-16 |
| 9799671 | Three-dimensional integration schemes for reducing fluorine-induced electrical shorts | Jayavel Pachamuthu, Stephen Shi, Johann Alsmeier | 2017-10-24 |
| 9748266 | Three-dimensional memory device with select transistor having charge trapping gate dielectric layer and methods of making and operating thereof | Ashish Baraskar, Yanli Zhang, Liang Pang, Ching-Huang Lu, Yingda Dong | 2017-08-29 |
| 9698152 | Three-dimensional memory structure with multi-component contact via structure and method of making thereof | Somesh Peri, Sateesh Koka, Raghuveer S. Makala, Rahul Sharangpani, Jayavel Pachamuthu +1 more | 2017-07-04 |
| 9553146 | Three dimensional NAND device having a wavy charge storage layer | Yanli Zhang, Akira Matsudaira, Yao-Sheng Lee, Johann Alsmeier | 2017-01-24 |
| 9419135 | Three dimensional NAND device having reduced wafer bowing and method of making thereof | Jayavel Pachamuthu, Johann Alsmeier | 2016-08-16 |
| 9209031 | Metal replacement process for low resistance source contacts in 3D NAND | Johann Alsmeier, Akira Matsudaira, Jayavel Pachamuthu | 2015-12-08 |