Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985172 | Three-dimensional memory device with mobility-enhanced vertical channels and methods of forming the same | Yanli Zhang, Fei Zhou, Raghuveer S. Makala | 2021-04-20 |
| 10854629 | Three-dimensional memory device containing asymmetric, different size support pillars and method for making the same | Jixin Yu, Fabo Yu, Xin Li, Yanli Zhang | 2020-12-01 |
| 10658381 | Memory die having wafer warpage reduction through stress balancing employing rotated three-dimensional memory arrays and method of making the same | Jixin Yu, Fumiaki Toyama, Masaaki Higashitani, Tong Zhang, Xin Li +1 more | 2020-05-19 |
| 10256248 | Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof | Zhenyu Lu, Jixin Yu, Johann Alsmeier, Fumiaki Toyama, Yuki Mizutani +5 more | 2019-04-09 |
| 10115732 | Three dimensional memory device containing discrete silicon nitride charge storage regions | Jixin Yu, Zhenyu Lu, Daxin Mao, Yanli Zhang, Andrey Serov +1 more | 2018-10-30 |
| 10115736 | Methods and apparatus for three-dimensional NAND non-volatile memory devices with side source line and mechanical support | Jin Liu, Johann Alsmeier | 2018-10-30 |
| 10103169 | Method of making a three-dimensional memory device using a multi-step hot phosphoric acid wet etch process | Fei Zhou, Yanli Zhang, Raghuveer S. Makala, Takashi Orimoto | 2018-10-16 |
| 10074666 | Three-dimensional memory device with enhanced mechanical stability semiconductor pedestal and method of making thereof | Yanli Zhang, Johann Alsmeier, Fabo Yu, Jixin Yu | 2018-09-11 |
| 10008570 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Jixin Yu, Kento KITAMURA, Tong Zhang, Yanli Zhang, Satoshi Shimizu +6 more | 2018-06-26 |
| 9829435 | External cavity laser biosensor arrangements | Meng Lu, Brian T. Cunningham, Stephen C. Schulz | 2017-11-28 |
| 9799670 | Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof | Masatoshi Nishikawa, Jin Liu, Yanli Zhang | 2017-10-24 |
| 9780112 | Methods and apparatus for three-dimensional NAND non-volatile memory devices with side source line and mechanical support | Jin Liu, Johann Alsmeier | 2017-10-03 |
| 9679906 | Three-dimensional memory devices containing memory block bridges | Zhenyu Lu, Johann Alsmeier, Daxin Mao, Wenguang Shi, Sateesh Koka +3 more | 2017-06-13 |
| 6251799 | Method to provide low dielectric constant voids between adjacent conducting lines in a semiconductor device | Wei Lai, Yu-Ching Chang, Chih-Ming Chen | 2001-06-26 |
| 6184123 | Method to prevent delamination of spin-on-glass and plasma nitride layers using ion implantation | Liang Szuma, Chih-Ming Chen | 2001-02-06 |