Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185550 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2024-12-31 |
| 12137567 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Yongna Li, Feng Pan, Steve Weiyi Yang | 2024-11-05 |
| 12137568 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2024-11-05 |
| 11956953 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2024-04-09 |
| 11785776 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-10-10 |
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2023-09-12 |
| 11545505 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-01-03 |
| 11527547 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2022-12-13 |
| 11482532 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2022-10-25 |
| 10930663 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Yongna Li, Feng Pan, Steve Weiyi Yang | 2021-02-23 |
| 10923491 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2021-02-16 |
| 10910397 | Through array contact structure of three- dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2021-02-02 |
| 10886291 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2021-01-05 |
| 10593690 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2020-03-17 |
| 10553604 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2020-02-04 |
| 9853043 | Method of making a multilevel memory stack structure using a cavity containing a sacrificial fill material | Zhenyu Lu, Daxin Mao, Tong Zhang, Johann Alsmeier, Henry Chien | 2017-12-26 |
| 9728551 | Multi-tier replacement memory stack structure integration scheme | Ching-Huang Lu, Zhenyu Lu, Jixin Yu, Daxin Mao, Johann Alsmeier +1 more | 2017-08-08 |
| 9716101 | Forming 3D memory cells after word line replacement | Zhenyu Lu, Hiro Kinoshita, Daxin Mao, Johann Alsmeier, Yingda Dong +3 more | 2017-07-25 |
| 9679906 | Three-dimensional memory devices containing memory block bridges | Zhenyu Lu, Johann Alsmeier, Daxin Mao, Sateesh Koka, Raghuveer S. Makala +3 more | 2017-06-13 |
| 9543318 | Three dimensional memory device with epitaxial semiconductor pedestal for peripheral transistors | Zhenyu Lu, Daxin Mao, Koji Miyata, Junichi Ariyoshi, Johann Alsmeier +3 more | 2017-01-10 |
| 9530790 | Three-dimensional memory device containing CMOS devices over memory stack structures | Zhenyu Lu, Andrew Lin, Johann Alsmeier, Peter Rabkin, Wei Zhao +2 more | 2016-12-27 |
| 9502471 | Multi tier three-dimensional memory devices including vertically shared bit lines | Zhenyu Lu, Henry Chien, Johann Alsmeier, Koji Miyata, Tong Zhang +7 more | 2016-11-22 |
| 9449987 | Three dimensional memory device with epitaxial semiconductor pedestal for peripheral transistors | Koji Miyata, Zhenyu Lu, Andrew Lin, Daxin Mao, Jixin Yu +1 more | 2016-09-20 |