Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10038006 | Through-memory-level via structures for a three-dimensional memory device | Jixin Yu, Hiroyuki Ogawa, James Kai, Jin Liu, Johann Alsmeier | 2018-07-31 |
| 9978766 | Three-dimensional memory device with electrically isolated support pillar structures and method of making thereof | Naohiro Hosoda, Takeshi Kawamura, Kota Funayama | 2018-05-22 |
| 9818693 | Through-memory-level via structures for a three-dimensional memory device | Fumiaki Toyama, Hiroyuki Ogawa, James Kai, Yuki Mizutani, Jixin Yu +2 more | 2017-11-14 |
| 9818759 | Through-memory-level via structures for a three-dimensional memory device | James Kai, Jin Liu, Johann Alsmeier, Jixin Yu, Hiroyuki Ogawa | 2017-11-14 |
| 9401305 | Air gaps structures for damascene metal patterning | Yuji Takahashi, Takuya Futase, Satoshi Kamata | 2016-07-26 |