Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D994726 | Three-dimensional printer frame | Jackson Seidenberg, Vishnu Anantha | 2023-08-08 |
| 11571852 | Multi-filament three-dimensional printing | Samuel Holland, Mark Waller, Carlos Fernandez Arreola, Taylor S. Goodman, Kevin C. Rand | 2023-02-07 |
| D900176 | Spool for filament of a three-dimensional printer | Vishnu Anantha, Michael Joseph Kobida | 2020-10-27 |
| D900178 | Spool for filament of a three-dimensional printer | Vishnu Anantha, Michael Joseph Kobida | 2020-10-27 |
| D900179 | Extruder for a three-dimensional printer | Christopher James Yarka, Michael C. Pappas, Matthew Scott Sterling, Vishnu Anantha | 2020-10-27 |
| D895698 | Three-Dimensional printer frame | Jackson Seidenberg, Vishnu Anantha | 2020-09-08 |
| 9934601 | Three-dimensional surface texturing | Benjamin R. McCallum, Quynh Dinh, Andrew J. Askedall | 2018-04-03 |
| 7106101 | Functional pathway configuration at a system/IC interface | Steven Schlanger | 2006-09-12 |
| 7020958 | Methods forming an integrated circuit package with a split cavity wall | Elissa E. Carapella | 2006-04-04 |
| 6810435 | Programmable identification in a communications controller | Steven Schlanger | 2004-10-26 |
| 6153829 | Split cavity wall plating for an integrated circuit package | Elissa E. Carapella | 2000-11-28 |
| 6008988 | Integrated circuit package with a heat spreader coupled to a pair of electrical devices | — | 1999-12-28 |
| 5721454 | Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug | — | 1998-02-24 |
| 5691569 | Integrated circuit package that has a plurality of staggered pins | — | 1997-11-25 |
| 5483099 | Standardized power and ground design for pin grid array packages | Siva Natarajan, Udy Shrivastava, William M. Siu | 1996-01-09 |
| 5289337 | Heatspreader for cavity down multi-chip module with flip chip | Mostafa Aghazadeh | 1994-02-22 |