Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5982632 | Short power signal path integrated circuit package | Larry E. Mosley, Anna Madrid | 1999-11-09 |
| 5604330 | Staggered land pad pattern on substrate for tab interconnection | Altaf Hasan, J. D. Wilson | 1997-02-18 |
| 5519580 | Method of controlling solder ball size of BGA IC components | Debendra Mallik | 1996-05-21 |
| 5483099 | Standardized power and ground design for pin grid array packages | Udy Shrivastava, William M. Siu, Mark Palmer | 1996-01-09 |
| 5444602 | An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame | Koushik Banerjee, Debendra Mallik, Praveen Jain | 1995-08-22 |