Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7020958 | Methods forming an integrated circuit package with a split cavity wall | Mark Palmer | 2006-04-04 |
| 6153829 | Split cavity wall plating for an integrated circuit package | Mark Palmer | 2000-11-28 |