Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Clipless integrated heat spreader process and materials

Clipless integrated heat spreader process and materials

US Patent 8163598 · Granted Apr 24, 2012

Estimated economic value: $30,122,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

First layer interconnect first on carrier approach for EMIB patch2025
Position controlled waveguides and methods of manufacturing the same2025
First layer interconnect first on carrier approach for EMIB patch2025
Die last and waveguide last architecture for silicon photonic packaging2025
Methods and apparatus to reduce defects in interconnects between semiconductor d2025
Methods and apparatus to reduce defects in interconnects between semicondcutor d2025
Airgap structures for high speed signal integrity2025
Thermal compression bonder nozzle with vacuum relief features2024
Selectively roughened copper architectures for low insertion loss conductive fea2024
Conductive route patterning for electronic substrates2024
Subtractive etch resolution implementing a functional thin metal resist2024
Conductive route patterning for electronic substrates2023