{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Antenna package using ball attach array to connect antenna and base substrates", "item": "https://www.patentleaderboard.com/patent/11355849"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Antenna package using ball attach array to connect antenna and base substrates

Antenna package using ball attach array to connect antenna and base substrates

US Patent 11355849 · Granted Jun 7, 2022

Estimated economic value: $12,864,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Multi-chip packaging2025
Fine-grained disaggregated server architecture2025
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arr2025
Selective interconnects in back-end-of-line metallization stacks of integrated c2025
Contiguous shield structures in microelectronic assemblies having hybrid bonding2025
Microelectronic assemblies having backside die-to-package interconnects2025
Microelectronic assemblies2025