Issued Patents All Time
Showing 26–50 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199063 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2025-01-14 |
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2024-12-31 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Patrick Morrow +3 more | 2024-12-24 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi +3 more | 2024-12-17 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Feras Eid | 2024-12-10 |
| 12155372 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2024-11-26 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12148747 | Gallium nitride (GAN) three-dimensional integrated circuit technology | Han Wui Then, Marko Radosavljevic, Pratik KOIRALA, Nicole K. Thomas, Paul B. Fischer +5 more | 2024-11-19 |
| 12142543 | Thermal management solutions for embedded integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2024-11-12 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Shawna M. Liff, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov, Feras Eid | 2024-11-12 |
| 12136596 | Microelectronic assemblies | Aleksandar Aleksov | 2024-11-05 |
| 12113048 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Shawna M. Liff | 2024-10-08 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more | 2024-09-10 |
| 12080652 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2024-09-03 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Aleksandar Aleksov, Adel A. Elsherbini, Shawna M. Liff, Feras Eid, Randy B. Osborne +1 more | 2024-08-06 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Aleksandar Aleksov, Feras Eid, Georgios Dogiamis | 2024-07-16 |
| 12014990 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2024-06-18 |
| 12007170 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2024-06-11 |
| 11990448 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff | 2024-05-21 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Georgios Dogiamis, Shawna M. Liff, Zhiguo Qian | 2024-05-14 |
| 11967580 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2024-04-23 |
| 11933555 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Adel A. Elsherbini | 2024-03-19 |