Issued Patents All Time
Showing 76–100 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Telesphor Kamgaing | 2023-08-01 |
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2023-07-04 |
| 11694962 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2023-07-04 |
| 11694951 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings | 2023-07-04 |
| 11688665 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-06-27 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Telesphor Kamgaing | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11652074 | Semiconductor package with improved thermal blocks | Feras Eid | 2023-05-16 |
| 11652059 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Lift, Gerald Pasdast | 2023-05-16 |
| 11641711 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2023-05-02 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini | 2023-04-04 |
| 11621208 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-04-04 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis | 2023-04-04 |
| 11616047 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Shawna M. Liff | 2023-03-28 |
| 11615998 | Thermal management solutions for embedded integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-03-28 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Shawna M. Liff +1 more | 2023-03-14 |
| 11600594 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2023-03-07 |
| 11594801 | Mmwave dielectric waveguide interconnect topology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Kenneth D. Shoemaker +1 more | 2023-02-28 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2023-02-14 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Jimin Yao, Veronica Strong | 2023-02-14 |
| 11581272 | Contactless high-frequency interconnect | Henning Braunisch, Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler +1 more | 2023-02-14 |
| 11575749 | Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Telesphor Kamgaing | 2023-02-07 |
| 11569428 | Superconducting qubit device packages | Jeanette M. Roberts, Adel A. Elsherbini, Shawna M. Liff, Roman Caudillo, Zachary R. Yoscovits +4 more | 2023-01-31 |