Issued Patents All Time
Showing 126–150 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367707 | Semiconductor package or structure with dual-sided interposers and memory | Shawna M. Liff, Adel A. Elsherbini, Gerald Pasdast | 2022-06-21 |
| 11348895 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2022-05-31 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Patrick Morrow +3 more | 2022-05-31 |
| 11348912 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Arun Chandrasekhar | 2022-05-31 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Feras Eid, Adel A. Elsherbini, Veronica Strong | 2022-05-31 |
| 11342243 | Thermal management solutions for embedded integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2022-05-24 |
| 11342320 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Arun Chandrasekhar | 2022-05-24 |
| 11342305 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Lift | 2022-05-24 |
| 11335641 | Microelectronic assemblies | Aleksandar Aleksov | 2022-05-17 |
| 11335663 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2022-05-17 |
| 11335665 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2022-05-17 |
| 11336559 | Fast-lane routing for multi-chip packages | Adel A. Elsherbini, Tejpal Singh, Shawna M. Liff, Gerald Pasdast | 2022-05-17 |
| 11335642 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2022-05-17 |
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Sergio Antonio Chan Arguedas, John J. Beatty | 2022-05-10 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, John J. Beatty | 2022-05-10 |
| 11328986 | Capacitor-wirebond pad structures for integrated circuit packages | Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Telesphor Kamgaing | 2022-05-10 |
| 11329359 | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch | 2022-05-10 |
| 11316497 | Multi-filter die | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2022-04-26 |
| 11310907 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2022-04-19 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +1 more | 2022-04-19 |
| 11302599 | Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure | Feras Eid, Adel A. Elsherbini | 2022-04-12 |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Feras Eid, Shawna M. Liff, Thomas L. Sounart | 2022-04-12 |
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Javier A. Falcon, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini +1 more | 2022-04-05 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Feras Eid, Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini | 2022-03-29 |