Issued Patents All Time
Showing 176–200 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062947 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis | 2021-07-13 |
| 11049791 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Jimin Yao, Veronica Strong | 2021-06-29 |
| 11037892 | Substrate dielectric waveguides in semiconductor packages | Vijay K. Nair, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis, Adel A. Elsherbini | 2021-06-15 |
| 11031666 | Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Shawna M. Liff +3 more | 2021-06-08 |
| 11024933 | Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer | Brandon M. Rawlings, Shawna M. Liff, Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing +3 more | 2021-06-01 |
| 11016288 | Adaptable displays using piezoelectric actuators | Sasha N. Oster, Feras Eid, Thomas L. Sounart, Aleksandar Aleksov, Shawna M. Liff +2 more | 2021-05-25 |
| 11011470 | Microelectronic package with mold-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2021-05-18 |
| 10998879 | Monolithic die with acoustic wave resonators and active circuitry | Telesphor Kamgaing, Georgios Dogiamis, Feras Eid, Aleksandar Aleksov | 2021-05-04 |
| 10998302 | Packaged device with a chiplet comprising memory resources | Adel A. Elsherbini, Van H. Le, Shawna M. Liff, Patrick Morrow, Gerald Pasdast +1 more | 2021-05-04 |
| 10998272 | Organic interposers for integrated circuit packages | Aleksandar Aleksov, Henning Braunisch, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-05-04 |
| 10992016 | Multiplexer and combiner structures embedded in a mmwave connector interface | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis | 2021-04-27 |
| 10976822 | Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems | Georgios Dogiamis, Aleksandar Aleksov | 2021-04-13 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2021-04-06 |
| 10969576 | Piezo actuators for optical beam steering applications | Aleksandar Aleksov, Feras Eid, Sasha N. Oster, Shawna M. Liff, Thomas L. Sounart +2 more | 2021-04-06 |
| 10969574 | Process for creating piezo-electric mirrors in package | Sasha N. Oster, Feras Eid, Shawna M. Liff, Aleksandar Aleksov, Thomas L. Sounart +2 more | 2021-04-06 |
| 10964992 | Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide | Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Gilbert Dewey, Telesphor Kamgaing +1 more | 2021-03-30 |
| 10964178 | Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems | Aleksandar Aleksov, Georgios Dogiamis | 2021-03-30 |
| 10951248 | Radio frequency (RF) module with shared inductor | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Aleksandar Aleksov | 2021-03-16 |
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings +3 more | 2021-03-16 |
| 10943851 | Reconstituted wafer assembly | Adel A. Elsherbini, Shawna M. Liff, Henning Braunisch | 2021-03-09 |
| 10937594 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Thomas L. Sounart, Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Kristof Darmawikarta | 2021-03-02 |
| 10921349 | Piezoelectric package-integrated current sensing devices | Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff, Jelena Culic-Viskota, Thomas L. Sounart +2 more | 2021-02-16 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2021-02-16 |
| 10921524 | Crimped mm-wave waveguide tap connector | Adel A. Elsherbini, Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Telesphor Kamgaing | 2021-02-16 |
| 10903818 | Piezoelectric package-integrated film bulk acoustic resonator devices | Vijay K. Nair, Feras Eid, Adel A. Elsherbini, Telesphor Kamgaing, Georgios Dogiamis +1 more | 2021-01-26 |