Issued Patents All Time
Showing 151–175 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Vijay K. Nair | 2022-03-22 |
| 11282812 | Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers | Adel A. Elsherbini, Feras Eid | 2022-03-22 |
| 11270947 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2022-03-08 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Veronica Strong | 2022-03-01 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2022-02-01 |
| 11234343 | Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices | Feras Eid, Adel A. Elsherbini | 2022-01-25 |
| 11227859 | Stacked package with electrical connections created using high throughput additive manufacturing | Feras Eid, Shawna M. Liff | 2022-01-18 |
| 11226162 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Adel A. Elsherbini | 2022-01-18 |
| 11222836 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings | 2022-01-11 |
| 11223524 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more | 2022-01-11 |
| 11222863 | Techniques for die stacking and associated configurations | Fay Hua, Christopher M. Pelto, Valluri Rao, Mark Bohr | 2022-01-11 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini | 2022-01-11 |
| 11217535 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2022-01-04 |
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh +2 more | 2021-12-28 |
| 11206008 | Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator dies | Georgios Dogiamis, Telesphor Kamgaing, Feras Eid, Vijay K. Nair | 2021-12-21 |
| 11205630 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Shawna M. Liff, Mauro Kobrinksy, Van H. Le +1 more | 2021-12-21 |
| 11189585 | Selective recess of interconnects for probing hybrid bond devices | Brennen Mueller, Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Pooya Tadayon | 2021-11-30 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Krishna Bharath, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2021-11-30 |
| 11183477 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Nagatoshi Tsunoda, Jimin Yao | 2021-11-23 |
| 11158917 | Dual-substrate waveguide filter | Aleksandar Aleksov, Telesphor Kamgaing, Georgios Dogiamis, Feras Eid | 2021-10-26 |
| 11147197 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2021-10-12 |
| 11133263 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Shawna M. Liff | 2021-09-28 |
| 11101205 | Interconnection structure fabrication using grayscale lithography | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2021-08-24 |
| 11095012 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2021-08-17 |
| 11094672 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2021-08-17 |