Issued Patents All Time
Showing 201–225 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10897238 | Piezoelectric package-integrated contour mode filter devices | Feras Eid, Georgios Dogiamis, Valluri Rao, Adel A. Elsherbini, Telesphor Kamgaing +1 more | 2021-01-19 |
| 10840430 | Piezoelectric package-integrated sensing devices | Feras Eid, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Adel A. Elsherbini +1 more | 2020-11-17 |
| 10816733 | Piezoelectrically actuated mirrors for optical communications | Sasha N. Oster, Feras Eid, Thomas L. Sounart, Aleksandar Aleksov, Shawna M. Liff +2 more | 2020-10-27 |
| 10777538 | System on package architecture including structures on die back side | Fay Hua, Telesphor Kamgaing | 2020-09-15 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2020-09-01 |
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch | 2020-08-04 |
| 10721568 | Piezoelectric package-integrated acoustic transducer devices | Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Thomas L. Sounart +1 more | 2020-07-21 |
| 10685949 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Mauro J. Kobrinsky, Rajendra C. Dias | 2020-06-16 |
| 10672701 | Thin electronic package elements using laser spallation | Vivek Raghunathan, Yonggang Li, Aleksandar Aleksov, Adel A. Elsherbini | 2020-06-02 |
| 10658566 | Piezoelectric driven switches integrated in organic, flexible displays | Shawna M. Liff, Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen +3 more | 2020-05-19 |
| 10649158 | Alignment of single and multi-mode optical fibers using piezoelectric actuators | Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Baris Bicen, Thomas L. Sounart +2 more | 2020-05-12 |
| 10644616 | Piezoelectric package-integrated motor | Shawna M. Liff, Georgios Dogiamis, Sasha N. Oster, Feras Eid, Adel A. Elsherbini +1 more | 2020-05-05 |
| 10634566 | Piezoelectric package-integrated temperature sensing devices | Feras Eid, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart, Adel A. Elsherbini +1 more | 2020-04-28 |
| 10594294 | Piezoelectric package-integrated delay lines | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair +2 more | 2020-03-17 |
| 10594029 | Actuatable and adaptable metamaterials integrated in package | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more | 2020-03-17 |
| 10566672 | Waveguide connector with tapered slot launcher | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +1 more | 2020-02-18 |
| 10510669 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2019-12-17 |
| 10508961 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Weng Hong Teh | 2019-12-17 |
| 10484120 | Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Erich N. Ewy | 2019-11-19 |
| 10483250 | Three-dimensional small form factor system in package architecture | Vijay K. Nair, Adel A. Elsherbini, Lakshman Krishnamurthy, Alexander Essaian, Torrey W. Frank | 2019-11-19 |
| 10475736 | Via architecture for increased density interface | Aleksandar Aleksov, Arnab Sarkar, Arghya Sain, Kristof Darmawikarta, Henning Braunisch +3 more | 2019-11-12 |
| 10453635 | Package MEMS switch and method | Qing Ma, Valluri Rao, Feras Eid | 2019-10-22 |
| 10432167 | Piezoelectric package-integrated crystal devices | Adel A. Elsherbini, Feras Eid, Baris Bicen, Telesphor Kamgaing, Vijay K. Nair +2 more | 2019-10-01 |
| 10424559 | Thermal management of molded packages | Feras Eid, Nader N. Abazarnia, Taesha D. Beasley, Sasha N. Oster, Tannaz Harirchian +1 more | 2019-09-24 |
| 10361142 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Don Nelson | 2019-07-23 |