Issued Patents All Time
Showing 251–275 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2017-12-12 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9800015 | Optical interconnect on bumpless build-up layer package | Feras Eid, Weng Hong Teh | 2017-10-24 |
| 9793201 | Glass clad microelectronic substrate | Qing Ma | 2017-10-17 |
| 9735893 | Patch system for in-situ therapeutic treatment | Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Amit S. Baxi +3 more | 2017-08-15 |
| 9711428 | Dual-sided die packages | Henning Braunisch, Feras Eid, Adel A. Elsherbini, Don Nelson | 2017-07-18 |
| 9691579 | Package MEMS switch and method | Qing Ma, Valluri Rao, Feras Eid | 2017-06-27 |
| 9686861 | Glass core substrate for integrated circuit devices and methods of making the same | Qing Ma, Quan Tran, Robert L. Sankman, Valluri Rao | 2017-06-20 |
| 9647636 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Georgios Dogiamis +1 more | 2017-05-09 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9635764 | Integrated circuit and method that utilize a shape memory material | Shipeng Qiu, Shawna M. Liff, Kayleen L. E. Helms, Joshua D. Heppner, Adel A. Elsherbini +1 more | 2017-04-25 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Min Tao, Charles A. Gealer, Edward Zarbock | 2017-04-11 |
| 9601406 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Feras Eid, Ashish Gupta | 2017-03-21 |
| 9591758 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Mauro J. Kobrinsky, Rajendra C. Dias | 2017-03-07 |
| 9564408 | Space transformer | Aleksandar Aleksov | 2017-02-07 |
| 9507086 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block | 2016-11-29 |
| 9445496 | Glass clad microelectronic substrate | Qing Ma | 2016-09-13 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Qing Ma, Feras Eid, Kevin Lin, Weng Hong Teh, Valluri Rao | 2016-08-30 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more | 2016-08-02 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2016-07-19 |
| 9374162 | Semiconductor package with optical port | Robert L. Sankman, Dmitri E. Nikonov, Raseong Kim | 2016-06-21 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Min Tao, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |
| 9361059 | Architecture for seamless integrated display system | Uygar E. Avci, Islam A. Salama, Ravi Pallarisetty | 2016-06-07 |
| 9310565 | Cloaking system with waveguides | Ian A. Young, Robert L. Sankman, Marko Radosavljevic | 2016-04-12 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2016-03-29 |