Issued Patents All Time
Showing 276–295 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9275969 | Optical interconnect on bumpless build-up layer package | Feras Eid, Weng Hong Teh | 2016-03-01 |
| 9200973 | Semiconductor package with air pressure sensor | Kevin Lin, Qing Ma, Feras Eid, Weng Hong Teh | 2015-12-01 |
| 9001520 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2015-04-07 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more | 2014-07-22 |
| 8513966 | Probes formed from semiconductor region vias | Qing Ma, Roy E. Swart, Paul B. Fischer | 2013-08-20 |
| 8230589 | Method of mounting an optical device | Daoqiang Lu, Henning Braunisch | 2012-07-31 |
| 8227904 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2012-07-24 |
| 8207453 | Glass core substrate for integrated circuit devices and methods of making the same | Qing Ma, Quan Tran, Robert L. Sankman, Valluri Rao | 2012-06-26 |
| 7952194 | Silicon interposer-based hybrid voltage regulator system for VLSI devices | Raj Nair, Bala Natarajan, Mark Bohr | 2011-05-31 |
| 7888183 | Thinned die integrated circuit package | Cheng-Yi Liu, Steven Towle, Chuan Hu | 2011-02-15 |
| 7420273 | Thinned die integrated circuit package | Cheng-Yi Liu, Chuan Hu, Steven Towle | 2008-09-02 |
| 7418163 | Optoelectrical package | Kishore K. Chakravorty, Joseph F. Ahadian, Thomas P. Thomas, Brandon Barnett, Ian A. Young | 2008-08-26 |
| 7345361 | Stackable integrated circuit packaging | Debendra Mallik, Kinya Ichikawa, Terry Sterrett | 2008-03-18 |
| 7112887 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Bala Natarajan, Chien Chiang, Greg Atwood, Valluri Rao | 2006-09-26 |
| 7049704 | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board | Kishore K. Chakravorty, Brandon Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian A. Young | 2006-05-23 |
| 6908845 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Ravi Mahajan, Bala Natarajan | 2005-06-21 |
| 6848177 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Bala Natarajan, Chien Chiang, Greg Atwood, Valluri Rao | 2005-02-01 |
| 6841413 | Thinned die integrated circuit package | Cheng-Yi Liu, Steven Towle | 2005-01-11 |
| 6754407 | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board | Kishore K. Chakravorty, Brandon Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian A. Young | 2004-06-22 |
| 6512861 | Packaging and assembly method for optical coupling | Kishore K. Chakravorty, Ian A. Young, Joseph F. Ahadian | 2003-01-28 |