Issued Patents All Time
Showing 226–250 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319896 | Shielded interconnects | Javier A. Falcon, Adel A. Elsherbini, Shawna M. Liff, Ye Seul Nam, James S. Clarke +2 more | 2019-06-11 |
| 10314171 | Package assembly with hermetic cavity | Aleksandar Aleksov, Feras Eid | 2019-06-04 |
| 10304804 | System on package architecture including structures on die back side | Fay Hua, Telesphor Kamgaing | 2019-05-28 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch | 2019-05-28 |
| 10291283 | Tunable radio frequency systems using piezoelectric package-integrated switching devices | Telesphor Kamgaing, Feras Eid, Adel A. Elsherbini, Georgios Dogiamis, Vijay K. Nair +1 more | 2019-05-14 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2019-04-16 |
| 10256211 | Multi-chip-module semiconductor chip package having dense package wiring | Chuan Hu, Chia-Pin Chiu | 2019-04-09 |
| 10256521 | Waveguide connector with slot launcher | Adel A. Elsherbini, Sasha N. Oster, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +1 more | 2019-04-09 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff +3 more | 2019-04-02 |
| 10251272 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Aleksandar Aleksov, Feras Eid, Thomas L. Sounart, Georgios Dogiamis | 2019-04-02 |
| 10156583 | Method of making an accelerometer | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2018-12-18 |
| 10116504 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more | 2018-10-30 |
| 10070524 | Method of making glass core substrate for integrated circuit devices | Qing Ma, Quan Tran, Robert L. Sankman, Valluri Rao | 2018-09-04 |
| 10054737 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block | 2018-08-21 |
| 10039186 | Stretchable and flexible electrical substrate interconnections | Amit S. Baxi, Vincent S. Mageshkumar, Adel A. Elsherbini, Sasha N. Oster, Feras Eid +1 more | 2018-07-31 |
| 10032052 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Georgios Dogiamis +1 more | 2018-07-24 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |
| 9967040 | Patch system for in-situ therapeutic treatment | Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Amit S. Baxi +3 more | 2018-05-08 |
| 9954309 | Magnetic detachable electrical connections between circuits | Feras Eid, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov, Amit S. Baxi +1 more | 2018-04-24 |
| 9952823 | Architecture for seamless integrated display system | Uygar E. Avci, Islam A. Salama, Ravi Pillarisetty | 2018-04-24 |
| 9927211 | Cloaking system with waveguides | Ian A. Young, Robert L. Sankman, Marko Radosavljevic | 2018-03-27 |
| 9902152 | Piezoelectric package-integrated synthetic jet devices | Feras Eid, Shawna M. Liff, Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis +1 more | 2018-02-27 |
| 9893438 | Electrical connectors for high density attach to stretchable boards | Sasha N. Oster, Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Amit S. Baxi +1 more | 2018-02-13 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Sujit Sharan | 2018-01-23 |
| 9865521 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Feras Eid, Ashish Gupta | 2018-01-09 |