Issued Patents All Time
Showing 51–75 of 295 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff | 2024-02-27 |
| 11916020 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2024-02-27 |
| 11901330 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2024-02-13 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh +2 more | 2024-02-06 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2024-01-16 |
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis | 2023-12-12 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Shawna M. Liff, Adel A. Elsherbini, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11830787 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2023-11-28 |
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2023-11-21 |
| 11823972 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-11-21 |
| 11791277 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2023-10-17 |
| 11784181 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Veronica Strong | 2023-10-10 |
| 11784108 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov | 2023-10-10 |
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Sergio Antonio Chan Arguedas, John J. Beatty | 2023-10-03 |
| 11769734 | Microelectronic assemblies | Aleksandar Aleksov | 2023-09-26 |
| 11769751 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff | 2023-09-26 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch | 2023-09-19 |
| 11756943 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2023-09-12 |
| 11751367 | Microelectronic package electrostatic discharge (ESD) protection | Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid | 2023-09-05 |
| 11749642 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2023-09-05 |
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more | 2023-09-05 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Shawna M. Liff, Patrick Morrow, Gerald Pasdast, Van H. Le | 2023-09-05 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more | 2023-08-08 |