Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | Donald W. Nelson, Patrick Morrow, Kimin Jun | 2018-09-04 | $19,235,000 |