Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10439057 | Multi-gate high electron mobility transistors and methods of fabrication | Sansaptak Dasgupta, Alejandro X. Levander, Patrick Morrow | 2019-10-08 |
| 10367070 | Methods of forming backside self-aligned vias and structures formed thereby | Patrick Morrow, Mauro J. Kobrinsky, Il-Seok Son, Paul B. Fischer | 2019-07-30 |
| 10361090 | Vertical channel transistors fabrication process by selective subtraction of a regular grid | Patrick Morrow, Donald W. Nelson | 2019-07-23 |
| 10297592 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, M. Clair Webb, Donald W. Nelson | 2019-05-21 |
| 10236282 | Partial layer transfer system and method | Patrick Morrow, Il-Seok Son, Rajashree Baskaran, Paul B. Fischer | 2019-03-19 |
| 10186484 | Metal on both sides with clock gated-power and signal routing underneath | Donald W. Nelson, Patrick Morrow | 2019-01-22 |
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | Donald W. Nelson, M Clair Webb, Patrick Morrow | 2018-09-04 |
| 10043797 | Techniques for forming vertical transistor architectures | Patrick Morrow | 2018-08-07 |
| 10014374 | Planar heterogeneous device | Patrick Morrow | 2018-07-03 |
| 9935191 | High electron mobility transistor fabrication process on reverse polarized substrate by layer transfer | Sansaptak Dasgupta, Alejandro X. Levander, Patrick Morrow | 2018-04-03 |
| 9920438 | Methods and apparatus for ultrathin catalyst layer for photoelectrode | Joseph M. Jacobson | 2018-03-20 |
| 9835648 | Liquid metal interconnects | Rajashree Baskaran, Ting Zhong, Roy E. Swart, Paul B. Fischer | 2017-12-05 |
| 9818751 | Methods of forming buried vertical capacitors and structures formed thereby | Rajashree Baskaran, Patrick Morrow | 2017-11-14 |
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, M. Clair Webb, Il-Seok Son | 2017-08-01 |
| 9685436 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, M. Clair Webb, Donald W. Nelson | 2017-06-20 |
| 9646972 | Methods of forming buried vertical capacitors and structures formed thereby | Rajashree Baskaran, Patrick Morrow | 2017-05-09 |
| 9590051 | Heterogeneous layer device | Patrick Morrow | 2017-03-07 |
| 9548320 | Heterogeneous semiconductor material integration techniques | Alejandro X. Levander | 2017-01-17 |
| 9490201 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, M. Clair Webb, Il-Seok Son | 2016-11-08 |
| 9177967 | Heterogeneous semiconductor material integration techniques | Alejandro X. Levander | 2015-11-03 |