Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417593 | Dies with integrated voltage regulators | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2022-08-16 |
| 11404364 | Multi-layer embedded magnetic inductor coil | Huong Do, Kaladhar Radhakrishnan, Yikang Deng, Amruthavalli Pallavi Alur | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Yikang Deng, Amruthavalli Pallavi Alur | 2022-07-19 |
| 11380652 | Multi-level distributed clamps | Beomseok Choi, Kaladhar Radhakrishnan, William J. Lambert, Michael J. Hill | 2022-07-05 |
| 11353900 | Integrated cross-domain power transfer voltage regulators | Beomseok Choi, Siddharth Kulasekaran | 2022-06-07 |
| 11329358 | Low loss and low cross talk transmission lines having l-shaped cross sections | Adel A. Elsherbini, Mathew J. Manusharow, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2022-05-10 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11211866 | Reconfigurable inductor | William J. Lambert, Kaladhar Radhakrishnan, Beomseok Choi, Michael J. Hill | 2021-12-28 |
| 11189580 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Strong | 2021-11-30 |
| 10971416 | Package power delivery using plane and shaped vias | Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10971453 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Henning Braunisch, Javier Soto Gonzalez +1 more | 2021-04-06 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2020-05-12 |
| 10503227 | Apparatus and method to reduce power losses in an integrated voltage regulator | Srikrishnan Venkataraman, William J. Lambert, Michael J. Hill, Alexander Slepoy, Dong Zhong +3 more | 2019-12-10 |
| 10410939 | Package power delivery using plane and shaped vias | Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2019-09-10 |
| 10186465 | Package-integrated microchannels | Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Mathew J. Manusharow +2 more | 2019-01-22 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2018-06-05 |
| 9753510 | Apparatus and method to reduce power losses in an integrated voltage regulator | Srikrishnan Venkataraman, William J. Lambert, Michael J. Hill, Alexander Slepoy, Dong Zhong +3 more | 2017-09-05 |
| 9607947 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Kyu Oh Lee | 2017-03-28 |
| 9391025 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Kyu Oh Lee | 2016-07-12 |
| 9129817 | Magnetic core inductor (MCI) structures for integrated voltage regulators | Adel A. Elsherbini, Kevin P. O'Brien, Henning Braunisch | 2015-09-08 |
| 9041205 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Kyu Oh Lee | 2015-05-26 |
| 8219377 | Multi-layer finite element method for modeling of package power and ground planes | Madhavan Swaminathan | 2012-07-10 |