Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Kok Yau Chua, Swee Kah Lee, Chee Yang Ng, Horst Theuss | 2018-01-16 |
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Stefan Martens, Matthias Steiert, Kian Hong Yeo +3 more | 2016-10-25 |
| 8053280 | Method of producing multiple semiconductor devices | Chwee Lan Lai, Beng Keh See | 2011-11-08 |
| 7977161 | Method of manufacturing a semiconductor package using a carrier | Hsieh Ting Kuek | 2011-07-12 |
| 7838332 | Method of manufacturing a semiconductor package with a bump using a carrier | Soon Lock Goh | 2010-11-23 |