Issued Patents All Time
Showing 26–50 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Fabian Schnoy | 2022-04-12 |
| 11217510 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2022-01-04 |
| 11211304 | Assembly and method for mounting an electronic component to a substrate | Guenther Lohmann, Bernd Schmoelzer, Fabian Schnoy | 2021-12-28 |
| 10903133 | Method of producing an SMD package with top side cooling | Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2021-01-26 |
| 10896893 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2021-01-19 |
| 10892247 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2021-01-12 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |
| 10763246 | Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material | Klaus Schiess, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2020-09-01 |
| 10755999 | Multi-package top-side-cooling | Uwe Kirchner, Matteo-Alessandro Kutschak, Klaus Schiess, Bernd Schmoelzer | 2020-08-25 |
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Edward Fuergut, Christian Kasztelan | 2020-08-04 |
| 10699978 | SMD package with top side cooling | Amirul Afiq Hud, Teck Sim Lee, Xaver Schloegel, Bernd Schmoelzer | 2020-06-30 |
| 10698021 | Device including a compound semiconductor chip | Klaus Schiess | 2020-06-30 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2020-04-07 |
| 10566260 | SMD package with top side cooling | Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2020-02-18 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Edward Fuergut, Martin Gruber, Wolfgang Scholz | 2019-08-06 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee, Guenther Lohmann +5 more | 2019-08-06 |
| 10290566 | Electronic component | Klaus Schiess, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2019-05-14 |
| 10256119 | Method of manufacturing a semiconductor power package | Thomas Basler, Edward Fuergut, Christian Kasztelan | 2019-04-09 |
| 10229870 | Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress | — | 2019-03-12 |
| 10224912 | Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package | Josef Hoeglauer, Gerhard Noebauer | 2019-03-05 |
| 10204845 | Semiconductor chip package having a repeating footprint pattern | Amirul Afiq Hud, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Lee Shuang Wang +3 more | 2019-02-12 |
| 10109609 | Connection structure and electronic component | Josef Höglauer, Jürgen Schredl, Xaver Schlögel, Klaus Schiess | 2018-10-23 |
| 10037934 | Semiconductor chip package having contact pins at short side edges | Chooi Mei Chong, Raynold Talavera Corocotchia, Teck Sim Lee, Sanjay Kumar Murugan, Klaus Schiess +2 more | 2018-07-31 |
| 9991183 | Semiconductor component having inner and outer semiconductor component housings | Josef Hoeglauer, Teck Sim Lee, Klaus Schiess, Xaver Schloegel, Juergen Schredl | 2018-06-05 |