Issued Patents All Time
Showing 76–100 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595487 | Circuit arrangement and method for manufacturing the same | Klaus Schiess, Anton Mauder | 2017-03-14 |
| 9589904 | Semiconductor device with bypass functionality and method thereof | — | 2017-03-07 |
| 9525063 | Switching circuit | Klaus Schiess, Rainald Sander | 2016-12-20 |
| 9524941 | Power semiconductor housing with redundant functionality | — | 2016-12-20 |
| 9515060 | Multi-chip semiconductor power device | Josef Hoeglauer, Xaver Schloegel, Chooi Mei Chong | 2016-12-06 |
| 9478484 | Semiconductor packages and methods of formation thereof | Klaus Schiess, Chee Voon Tan | 2016-10-25 |
| 9449902 | Semiconductor packages having multiple lead frames and methods of formation thereof | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2016-09-20 |
| 9443787 | Electronic component and method | Klaus Schiess, Oliver Häberlen | 2016-09-13 |
| 9437516 | Chip-embedded packages with backside die connection | Josef Höglauer, Manfred Schindler, Johannes Lodermeyer, Thorsten Scharf | 2016-09-06 |
| 9412626 | Method for manufacturing a chip arrangement | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2016-08-09 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Wolfram Hable, Manfred Mengel +2 more | 2016-07-19 |
| 9385111 | Electronic component with electronic chip between redistribution structure and mounting structure | Manfred Mengel, Edward Fürgut, Jürgen Högerl | 2016-07-05 |
| 9379046 | Module comprising a semiconductor chip | Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law | 2016-06-28 |
| 9373566 | High power electronic component with multiple leadframes | Klaus Schiess, Teck Sim Lee | 2016-06-21 |
| 9368435 | Electronic component | Klaus Schiess, Dominic Maier, Chooi Mei Chong | 2016-06-14 |
| 9368434 | Electronic component | — | 2016-06-14 |
| 9362240 | Electronic device | Khalil Hosseini, Joachim Mahler, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel +1 more | 2016-06-07 |
| 9331060 | Device including two power semiconductor chips and manufacturing thereof | Josef Hoeglauer, Joachim Mahler, Johannes Lodermeyer | 2016-05-03 |
| 9263563 | Semiconductor device package | Fabio Brucchi, Franz Stückler, Teck Sim Lee | 2016-02-16 |
| 9263440 | Power transistor arrangement and package having the same | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2016-02-16 |
| 9230889 | Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low temperature co-fired ceramic | Marco Seibt | 2016-01-05 |
| 9230880 | Electronic device and method for fabricating an electronic device | Josef Hoeglauer, Juergen Schredl, Teck Sim Lee, Xaver Schloegel, Klaus Schiess | 2016-01-05 |
| 9196521 | Adjustable pick-up head and method for manufacturing a device | Abdul Rahman Mohamed, Subaramaniym Senivasan, Zakaria Abdullah | 2015-11-24 |
| 9196554 | Electronic component, arrangement and method | Josef Höglauer, Jürgen Schredl, Xaver Schlögel, Klaus Schiess | 2015-11-24 |
| 9196577 | Semiconductor packaging arrangement | Josef Höglauer, Jürgen Schredl, Xaver Schlögel, Klaus Schiess | 2015-11-24 |