Issued Patents All Time
Showing 101–125 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184066 | Chip arrangements and methods for manufacturing a chip arrangement | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2015-11-10 |
| 9165847 | Semiconductor device including a material to absorb thermal energy | Joachim Mahler, Khalil Hosseini | 2015-10-20 |
| 9159720 | Semiconductor module with a semiconductor chip and a passive component and method for producing the same | — | 2015-10-13 |
| 9147637 | Module including a discrete device mounted on a DCB substrate | Roland Rupp, Daniel Domes | 2015-09-29 |
| 9147631 | Semiconductor power device having a heat sink | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9147628 | Package-in-packages and methods of formation thereof | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9123526 | Module comprising a semiconductor chip | Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law | 2015-09-01 |
| 9123701 | Semiconductor die and package with source down and sensing configuration | Josef Höglauer, Gerhard Nöbauer, Martin Pölzi | 2015-09-01 |
| 9117786 | Chip module, an insulation material and a method for fabricating a chip module | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-08-25 |
| 9099391 | Semiconductor package with top-side insulation layer | Jürgen Schredl, Wolfgang Peinhopf, Fabio Brucchi, Josef Höglauer | 2015-08-04 |
| 9099441 | Power transistor arrangement and method for manufacturing the same | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-08-04 |
| 9099454 | Molded semiconductor package with backside die metallization | Ulrich Wachter, Veronika Huber, Thomas Kilger, Bernd Stadler, Dominic Maier +3 more | 2015-08-04 |
| 9093437 | Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device | — | 2015-07-28 |
| 9082878 | Method of fabricating a power semiconductor chip package | — | 2015-07-14 |
| 9082759 | Semiconductor packages and methods of formation thereof | Klaus Schiess, Fabio Brucchi | 2015-07-14 |
| 9048838 | Switching circuit | Klaus Schiess, Rainald Sander | 2015-06-02 |
| 9041184 | Chip-housing module and a method for forming a chip-housing module | — | 2015-05-26 |
| 9041170 | Multi-level semiconductor package | Josef Höglauer, Klaus Schiess, Chooi Mei Chong | 2015-05-26 |
| 9035437 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Guenther Lohmann, Josef Hoeglauer, Teck Sim Lee, Matteo-Alessandro Kutschak, Wolfgang Peinhopf | 2015-05-19 |
| 9018744 | Semiconductor device having a clip contact | Josef Hoeglauer, Khalil Hosseini | 2015-04-28 |
| 8987880 | Chip module and a method for manufacturing a chip module | Josef Hoeglauer, Xaver Schloegel | 2015-03-24 |
| 8987879 | Semiconductor device including a contact clip having protrusions and manufacturing thereof | — | 2015-03-24 |
| 8975735 | Redistribution board, electronic component and module | Josef Höglauer | 2015-03-10 |
| 8975711 | Device including two power semiconductor chips and manufacturing thereof | Josef Hoeglauer, Joachim Mahler, Johannes Lodermeyer | 2015-03-10 |
| 8975117 | Semiconductor device using diffusion soldering | Fong Lim, Abdul Rahman Mohamed, Chooi Mei Chong, Ida Fischbach, Xaver Schloegel +2 more | 2015-03-10 |