Issued Patents All Time
Showing 126–150 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8970032 | Chip module and method for fabricating a chip module | Josef Hoeglauer, Martin Standing | 2015-03-03 |
| 8952545 | Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof | Henrik Ewe, Klaus Schiess, Manfred Mengel | 2015-02-10 |
| 8933555 | Semiconductor chip package | Josef Hoeglauer | 2015-01-13 |
| 8916474 | Semiconductor modules and methods of formation thereof | Josef H•glauer | 2014-12-23 |
| 8896106 | Semiconductor packages having multiple lead frames and methods of formation thereof | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2014-11-25 |
| 8871630 | Manufacturing electronic device having contact elements with a specified cross section | Josef Hoeglauer | 2014-10-28 |
| 8860071 | Electro-thermal cooling devices and methods of fabrication thereof | — | 2014-10-14 |
| 8853835 | Chip arrangements, a chip package and a method for manufacturing a chip arrangement | Josef Hoeglauer, Gerhard Noebauer, Chooi Mei Chong | 2014-10-07 |
| 8853849 | Package arrangement and a method of manufacturing a package arrangement | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2014-10-07 |
| 8815647 | Chip package and a method for manufacturing a chip package | Bernd Roemer, Erich Griebl, Fabio Brucchi | 2014-08-26 |
| 8806741 | Method of making an electronic device | — | 2014-08-19 |
| 8766430 | Semiconductor modules and methods of formation thereof | Davide Chiola, Erich Griebl, Fabio Brucchi | 2014-07-01 |
| 8698293 | Multi-chip package and method of manufacturing thereof | Josef Hoeglauer, Juergen Schredl | 2014-04-15 |
| 8697497 | Module with silicon-based layer | Xaver Schloegel, Christof Matthias Schilz | 2014-04-15 |
| 8691631 | Device including two mounting surfaces | — | 2014-04-08 |
| 8658472 | Semiconductor device | — | 2014-02-25 |
| 8643176 | Power semiconductor chip having two metal layers on one face | Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2014-02-04 |
| 8642408 | Semiconductor device | Joachim Mahler, Bernd Rakow, Reimund Engl, Rupert Fischer | 2014-02-04 |
| 8642394 | Method of manufacturing electronic device on leadframe | Abdul Rahman Mohamed, Stanley Job Doraisamy, Tien Lai Tan | 2014-02-04 |
| 8637341 | Semiconductor module | Josef Hoeglauer, Helmut Strack, Xaver Schloegel | 2014-01-28 |
| 8633102 | Module comprising a semiconductor chip | Xaver Schloegel, Khai Huat Jeffrey Low, Chee Soon Law | 2014-01-21 |
| 8624378 | Chip-housing module and a method for forming a chip-housing module | — | 2014-01-07 |
| 8618644 | Electronic device and manufacturing thereof | Marco Seibt, Uwe Kirchner, Wolfgang Peinhopf, Michael Treu, Andreas Schloegl +1 more | 2013-12-31 |
| 8610274 | Die structure, die arrangement and method of processing a die | Khalil Hosseini, Frank Kahlmann, Josef Hoeglauer, Georg Meyer-Berg | 2013-12-17 |
| 8519545 | Electronic device comprising a chip disposed on a pin | — | 2013-08-27 |