Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198998 | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process | Kuan-Hsiang Mao, Yufu Liu, Wen-Hung Huang | 2025-01-14 |
| 11935753 | Backside and sidewall metallization of semiconductor devices | Kuan-Hsiang Mao, Wen-Hung Huang, Yufu Liu | 2024-03-19 |
| 11640947 | Pre-resist island forming via method and apparatus | Kuan-Hsiang Mao, Wen-Hung Huang, Yufu Liu | 2023-05-02 |
| 7178130 | Digital processing architecture using compiled dataflow definition | Dan Chuang, Bicheng Wu | 2007-02-13 |