Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418299 | Fan-out wafer level packaging structure | Chung-Hsuan Tsai | 2019-09-17 |
| 9711426 | Fan-out wafer level packaging structure | Chung-Hsuan Tsai | 2017-07-18 |
| 9484307 | Fan-out wafer level packaging structure | Chung-Hsuan Tsai | 2016-11-01 |
| 8358001 | Semiconductor device packages, redistribution structures, and manufacturing methods thereof | Hung-Jen Yang, Min-Lung Huang | 2013-01-22 |
| 8193647 | Semiconductor device package with an alignment mark | Hung-Jen Yang, Min-Lung Huang | 2012-06-05 |