Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10566279 | Package device, semiconductor device, and method for manufacturing the package device | Wen-Long LU, Jen-Kuang Fang, Min-Lung Huang, Chan Wen Liu | 2020-02-18 | $4,656,000 |
| 10424539 | Wiring structure, semiconductor package structure and semiconductor process | Wen-Long LU | 2019-09-24 | $1,225,000 |