Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288853 | Three-dimensional package and method of making the same | Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2012-10-16 |
| 8193647 | Semiconductor device package with an alignment mark | Chuehan Hsieh, Hung-Jen Yang | 2012-06-05 |
| 7741152 | Three-dimensional package and method of making the same | Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-06-22 |
| 7642132 | Three-dimensional package and method of making the same | Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-01-05 |
| 7528053 | Three-dimensional package and method of making the same | Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2009-05-05 |
| 7446404 | Three-dimensional package and method of making the same | Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2008-11-04 |
| 7420274 | Method for forming a redistribution layer in a wafer structure | — | 2008-09-02 |
| 7375020 | Method of forming bumps | Tsung-Hua Wu, Shih-Chang Lee, Jen-Kuang Fang, Yung-I Yeh | 2008-05-20 |
| 7358176 | Screen printing method of forming conductive bumps | — | 2008-04-15 |
| 7271498 | Bump electrodes having multiple under ball metallurgy (UBM) layers | — | 2007-09-18 |
| 7261828 | Bumping process | En-Chieh Wu, Chao-Fu Weng, Chi-Long Tsai, Chia-Ming Chuang | 2007-08-28 |
| 7253519 | Chip packaging structure having redistribution layer with recess | Chi-Long Tsai, Chao-Fu Weng, Ching-Huei Su | 2007-08-07 |
| 7250362 | Solder bump structure and method for forming the same | — | 2007-07-31 |
| 7232749 | Integrated circuit inductane and the fabrication method thereof | — | 2007-06-19 |
| 7220618 | Method for forming a redistribution layer in a wafer structure | — | 2007-05-22 |
| 7221052 | Chip scale package with micro antenna and method for manufacturing the same | Tsung-Hua Wu | 2007-05-22 |
| 7189646 | Method of enhancing the adhesion between photoresist layer and substrate and bumping process | — | 2007-03-13 |
| 7176117 | Method for mounting passive components on wafer | — | 2007-02-13 |
| 7151012 | Redistribution layer of wafer and the fabricating method thereof | — | 2006-12-19 |
| 7105433 | Method for treating wafer surface | Chi-Long Tsai | 2006-09-12 |
| 7064428 | Wafer-level package structure | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2006-06-20 |
| 7049705 | Chip structure | — | 2006-05-23 |
| 7030492 | Under bump metallurgic layer | — | 2006-04-18 |
| 7015130 | Method for making UBM pads and bumps on wafer | Chi-Long Tsai, Chao-Fu Weng, En-Chieh Wu, Yang Hong-Zen | 2006-03-21 |
| 6989326 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2006-01-24 |