Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package device and semiconductor process

Semiconductor package device and semiconductor process

US Patent 11721645 · Granted Aug 8, 2023

Estimated economic value: $1,262,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure and circuit layer structure including dummy trace and manufact2025
Semiconductor device package2024
Semiconductor device packages and methods of manufacturing the same2024
Thermal conduction unit, electronic module and heat dissipating device2023
Electronic device package2023
Semiconductor device package and method of manufacturing the same2023
Semiconductor device package and method of manufacturing the same2023
Package structure including pillars and method for manufacturing the same2023
Semiconductor package structure and method for manufacturing the same2022
Wiring structure and method for manufacturing the same2022
Semiconductor device and method of manufacturing the same2022
Package structure and circuit layer structure including dummy trace and manufact2022