Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7726544 | Method of packaging flip chip and method of forming pre-solders on substrate thereof | Jen-Kuang Fang | 2010-06-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7726544 | Method of packaging flip chip and method of forming pre-solders on substrate thereof | Jen-Kuang Fang | 2010-06-01 |