Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875683 | Method of forming bump | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2005-04-05 |
| 6861346 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2005-03-01 |
| 6846719 | Process for fabricating wafer bumps | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2005-01-25 |
| 6838311 | Flip chip package and method for forming the same | — | 2005-01-04 |
| 6827252 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-12-07 |
| 6820329 | Method of manufacturing multi-chip stacking package | — | 2004-11-23 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-06-29 |
| 6743707 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-06-01 |
| 6737353 | Semiconductor device having bump electrodes | Ching-Hua Chiang, Shih-Kuang Chen, Chau Fu Weng | 2004-05-18 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-05-11 |
| 6723630 | Solder ball fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-04-20 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-04-13 |
| 6716739 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-04-06 |
| 6713870 | Wafer level chip-scale package | — | 2004-03-30 |
| 6713320 | Bumping process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-03-30 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu +5 more | 2004-02-17 |
| 6673711 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-01-06 |
| 6664128 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +4 more | 2003-12-16 |
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2003-09-09 |
| 6469399 | Semiconductor package | Chun-Chi Lee | 2002-10-22 |
| 6342443 | Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate | Su Tao, Wei-Chung Wang | 2002-01-29 |
| 6153939 | Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same | Wei-Chung Wang, Hsueh-Te Wang, Su Tao | 2000-11-28 |
| 6150730 | Chip-scale semiconductor package | Chih-Ming Chung, Kuo-Pin Yang, Su Tao | 2000-11-21 |