Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7812431 | Leadframe with die pad and leads corresponding thereto | Su-Tai Yang, Wen-Chi Cheng | 2010-10-12 |
| 7429342 | Method for cleaning and regenerating a mold | — | 2008-09-30 |
| 6828002 | Substrate strip with sides having flanges and recesses | Win-Chi Cheng | 2004-12-07 |
| 6803089 | Cleaning substrate for cleaning and regenerating a mold | — | 2004-10-12 |
| 6722412 | Die bonder | Yao-Ting Huang | 2004-04-20 |
| 6118176 | Stacked chip assembly utilizing a lead frame | Su Tao, Kuang-Lin Lo, Shih-Chih Chen | 2000-09-12 |