Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6163076 | Stacked structure of semiconductor package | Chun-Chi Lee, Kuang-Lin Lo, Kuang-Chwn Chou | 2000-12-19 |
| 6118176 | Stacked chip assembly utilizing a lead frame | Su Tao, Kuang-Lin Lo, Kuang-Chun Chou | 2000-09-12 |